Multi-chip package series
ePOP
ePOP device integrates eMMC and LPDDR, reducing system development
time and lowering the difficulty of PCB design Adopting POP(Package on Package) design that mounts on the SoC to save
PCB space so that final product size can be minimized With its small size, low power consumption, and low cost, it is an ideal
solution for smart wearables
Product Selection
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Product Series
Density
DRAM Type
NAND Flash Type
Package Type
Dimensions(mm)
LPDDR3 Speed(Mbps)
Sequential Read Speed(MB/s)
Sequential Write Speed (MB/s)
NAND Operation Voltage
DRAM Operation Voltage
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Application field
Smart wear
Intelligent terminal