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Embedde Storage
Stable, safe and reliable performance
KOWIN with a diverse range of embedded storage chips, offers both consumer-grade and industrial-grade product lines. These chips meet the requirements for system fluency and data stability, making them an ideal choice for smart devices.
eMMC
Intelligent electronic core elf, support multi-scene application requirements
Compliant with JEDEC eMMC5.1 specifications and supports HS400 high-speed mode, ensuring good compatibility with mainstream platforms Utilizes SAMSUNG’s latest generation 3D NAND and high-performance NAND controller to ensure smooth and stable system operation Offers a full range of capacity options from 4GB to 256GB, supporting a wide variety of application scenario
eMMC Industrial grade
Smart industrial constant core elves escort the stable operation of industrial control equipment
Passed reliability and aging test in the harsh environment, the product
can withstand operating between -40 °C to 85°C Selected industrial grade NAND flash, to ensure the consistency of product
quality Long-term stable work in harsh environments to ensure normal operation
of the equipment
Small PKG. eMMC
Small micro intelligent core elf, help the terminal application miniaturization and miniaturization
Compatible with JEDEC eMMC5.1 specification and support HS400
high-speed mode 9.0mm * 7.5mm small size, 153Ball package, reduce PCB board space,
suitable for space-constrained smart wearable products Low power consumption, help the design and application of ultra-long
standby for end products
UFS
Mobile Internet Changxin Elf, to provide a new experience for smart mobile
Adopting 3D NAND FLASH which significantly improves product
density. The capacity is up to 1TB HS-GEAR4 interface significantly improves sequential read/write
performance. Processing time is shortened that device enter standby
mode eralier to reduces power consumption Ultimate speed experience, suitable for mobile intelligent terminal productsProduct Selection
Helping you easily find products that match your needs
Product Series
- All
- eMMC
- eMMC Industrial grade
- Small PKG. eMMC
- UFS
capacity
- All
- 4GB
- 8GB
- 16GB
- 32GB
- 64GB
- 128GB
- 256GB
- 512GB
- 1TB
Protocol standard
- All
- eMMC5.1
- UFS2.2
- UFS3.1
Velocity mode
- All
- HS400
- HS-GEAR3 2Lanes
- HS-GEAR4 2Lanes
NAND flash type
- All
- 2D MLC
- 3D TLC
Package type
- All
- 153 Ball FBGA
- 153 Ball BGA
Package size (mm)
- All
- 11.5x13.0x1.0
- 11.5x13.0x0.8
- 11.5x13.0x1.2
- 9.0x7.5x0.8
- 8.0x8.5x0.95
- 7.5x12.5x0.74
Read speed (MB/s)
- All
- 150
- 330
- 170
- 210
- 260
- 265
- 280
- 300
- 320
- 380
- 700
Write speed (MB/s)
- All
- 60
- 100
- 110
- 145
- 150
- 200
- 220
- 250
Operating voltage (VCC/VCCQ)
- All
- 3.3V/1.8Vor3.3V
- 3.3V/1.8V
- 2.5V/1.2V
- VCC:2.5V VCCQ:1.2V
- VCC:3.3V VCCQ2:1.8V
Operating temperature
- All
- -25°C-85°C
- -40°C-85°C
The current data is from the 1st to the 10th data points; There are a total of 24 records
| Serial Number | Model | capacity | Protocol standard | Velocity mode | NAND flash type | Package type | Package size (mm) | Read speed (MB/s) | Write speed (MB/s) | Operating voltage (VCC/VCCQ) | Operating temperature | check |
| 01 | KAUD7411 | 64GB | UFS2.2 | HS-GEAR3 2Lanes | 3D TLC | 153 Ball FBGA | 11.5x13.0x0.8 | 380 | 200 | VCC:3.3V VCCQ2:1.8V | -25°C-85°C | |
| 02 | KAUD8411 | 128GB | UFS2.2 | HS-GEAR3 2Lanes | 3D TLC | 153 Ball FBGA | 11.5x13.0x0.8 | 700 | 220 | VCC:3.3V VCCQ2:1.8V | -25°C-85°C | |
| 03 | KAUD9421 | 256GB | UFS2.2 | HS-GEAR3 2Lanes | 3D TLC | 153 Ball FBGA | 11.5x13.0x1.0 | 850 | 500 | VCC:3.3V VCCQ2:1.8V | -25°C-85°C | |
| 04 | KAUDA431 | 512GB | UFS2.2 | HS-GEAR3 2Lanes | 3D TLC | 153 Ball FBGA | 11.5x13.0x1.2 | 850 | 500 | VCC:3.3V VCCQ2:1.8V | -25°C-85°C | |
| 05 | KAUJ8511 | 128GB | UFS3.1 | HS-GEAR4 2Lanes | 3D TLC | 153 Ball FBGA | 11.5x13.0x0.8 | 2000 | 600 | VCC:2.5V VCCQ:1.2V | -25°C-85°C | |
| 06 | KAUJ9521 | 256GB | UFS3.1 | HS-GEAR4 2Lanes | 3D TLC | 153 Ball FBGA | 11.5x13.0x1.0 | 2000 | 1000 | VCC:2.5V VCCQ:1.2V | -25°C-85°C | |
| 07 | KAUJA531 | 512GB | UFS3.1 | HS-GEAR4 2Lanes | 3D TLC | 153 Ball FBGA | 11.5x13.0x1.2 | 2000 | 1200 | VCC:2.5V VCCQ:1.2V | -25°C-85°C | |
| 08 | KAUJB531 | 1TB | UFS3.1 | HS-GEAR4 2Lanes | 3D TLC | 153 Ball FBGA | 11.5x13.0x1.2 | 2000 | 1200 | VCC:2.5V VCCQ:1.2V | -25°C-85°C | |
| 09 | KAS04111 | 4GB | eMMC5.1 | HS400 | 2D MLC | 153 Ball FBGA | 11.5x13.0x1.0 | 150 | 60 | 3.3V/1.8Vor3.3V | -25°C-85°C | |
| 10 | KAS03111 | 8GB | eMMC5.1 | HS400 | 2D MLC | 153 Ball FBGA | 11.5x13.0x1.0 | 210 | 100 | 3.3V/1.8Vor3.3V | -25°C-85°C |
