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  • ePOP
Multi-chip package series
ePOP device integrates eMMC and LPDDR, reducing system development time and lowering the difficulty of PCB design
Adopting POP(Package on Package) design that mounts on the SoC to save PCB space so that final product size can be minimized
With its small size, low power consumption, and low cost, it is an ideal solution for smart wearables
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Product Series
NAND Flash Type
Package Type
LPDDR3 Speed(Mbps)
Sequential Read Speed(MB/s)
Sequential Write Speed (MB/s)
NAND Operation Voltage
DRAM Operation Voltage
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Application field
Smart wear
Intelligent terminal