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Embedde Storage
Stable, safe and reliable performance
KOWIN with a diverse range of embedded storage chips, offers both consumer-grade and industrial-grade product lines. These chips meet the requirements for system fluency and data stability, making them an ideal choice for smart devices.
eMCP
Intelligent terminal core elf, let the system run more smoothly
Adopting a multi-chip packaging solution for eMMC and LPDDR to reduce
system development time and PCB occupied area Isolated design between eMMC and LPDDR to effectively reduce signal
interference for stable data transmission
ePOP
Smart wearable core elf, make smart wearable devices thinner and lighter
ePOP device integrates eMMC and LPDDR, reducing system development
time and lowering the difficulty of PCB design Adopting POP(Package on Package) design that mounts on the SoC to save
PCB space so that final product size can be minimized With its small size, low power consumption, and low cost, it is an ideal
solution for smart wearables
nMCP
Smart iot core elf, with a long service life and data preservation capabilities
The nMCP chip integrates SLC NAND and LPDDR4X, reducing system
PCB development time Product combinations include 4Gb+2Gb, 4Gb+4Gb, 8Gb+4Gb, and 8Gb+8Gb,
meeting a variety of capacity needs Supports 1.8V low voltage for NAND, meeting the low power requirements
of some fields such as the Internet of Things (IoT)Product Selection
Helping you easily find products that match your needs
Product Series
Density
DRAM Type
NAND Flash Type
Package Type
Dimensions(mm)
LPDDR3 Speed(Mbps)
Sequential Read Speed(MB/s)
Sequential Write Speed (MB/s)
NAND Operation Voltage
DRAM Operation Voltage
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