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  • eMCP
Multi-chip package series
eMCP
Adopting a multi-chip packaging solution for eMMC and LPDDR to reduce system development time and PCB occupied area
Isolated design between eMMC and LPDDR to effectively reduce signal interference for stable data transmission
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Product Selection
Helping you easily find products that match your needs
Product Series
Density
DRAM Type
NAND Flash Type
Package Type
Dimensions(mm)
LPDDR3 Speed(Mbps)
Sequential Read Speed(MB/s)
Sequential Write Speed (MB/s)
NAND Operation Voltage
DRAM Operation Voltage
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Application field
Smart wear
Smart phone
Dictionary pen
Educational tablet
Iot module