Multi-chip package series
eMCP
Adopting a multi-chip packaging solution for eMMC and LPDDR to reduce
system development time and PCB occupied area Isolated design between eMMC and LPDDR to effectively reduce signal
interference for stable data transmission
Product Selection
Helping you easily find products that match your needs
Product Series
Density
DRAM Type
NAND Flash Type
Package Type
Dimensions(mm)
LPDDR3 Speed(Mbps)
Sequential Read Speed(MB/s)
Sequential Write Speed (MB/s)
NAND Operation Voltage
DRAM Operation Voltage
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Application field
Smart wear
Smart phone
Dictionary pen
Educational tablet
Iot module